Agenda

Andy Nold is a Quality Engineer and Commodity Engineer at Teradyne near Chicago, IL. He is the Factory ESD subject matter expert and performs the company’s internal ESD audits. He has worked for Teradyne since 2011.

Prior to Teradyne, Andy worked for the FAA, a small aerospace company, and the US Navy. Andy graduated from the University of Wisconsin with a bachelor’s degree in Applied Math, Engineering, and Physics and a master’s degree in Engineering Mechanics. 

Outside of work, Andy likes to spend time with his wife and kids.

Jay Skolnik is a licensed professional electrical engineer and is the co-founder and lead engineer/consultant of Skolnik Technical Training in Albuquerque, NM. With over thirty years of experience in the electronics industry, Jay has developed a multitude of products utilized in different industries, including military, defense, avionics, aerospace, commercial, industrial, medical, automotive, and sports entertainment.

As an ESDA certified program manager, Jay teaches ESD mitigation and control for the electronics and energetics specialties. He performs ESD audits to ensure factories and laboratories are following safe ESD control guidelines and procedures. He is also certified by iNARTE and is a certified professional instructor of national instruments (NI). He received his electrical engineering degree from the University of Missouri-Rolla.

David E. Swenson retired in 2003 after 35 years of service from 3M. While at 3M he had responsibility for new packaging material development and application, training of 3M personnel worldwide and providing application assistance to users of static control products globally with particular emphasis on Asia Pacific and Japan. Dave and his wife Geri established a new company, Affinity Static Control Consulting, LLC. in 2003.

Dave has been a member of the ESD Association since 1984 and has served in many capacities including 1997 Symposium General Chair and president of the Association in 1998 and 1999 and again in 2008 and 2009. He was re-elected to the Board of Directors for a 5th term from 2014 to 2016 and is currently appointed to the Board to assist with technical inquiries.

Dave was presented with the highest award of the ESD Association, the “Outstanding Contributions Award” in 2002, the Standards Committee “Joel P. Weidendorf Memorial Award” in 2004, the Association “Edward G. Weggeland” Memorial Award in 2014 and the Symposium Committee’s, David Barber, Sr. Memorial award in 2018.

He is a member of the Standards Committee serving several Working Groups and the ANSI/ESD S20.20 Standard Task Team.   Dave also serves as Treasurer and Information Liaison of the Texas Chapter of the ESD Association; he is a member of the Electrostatic Society of America, IMAPS, the UK Institute of Physics and is a US Expert to IEC TC101, Electrostatics. 

Olivier Marichal graduated from Katholieke Universiteit Leuven with a degree in Electrical Engineering in 2003 and has since dedicated his career to the field of Electrostatic Discharge (ESD) protection design, currently serving as Chief Engineering at Sofics. His journey with the company began shortly after graduation as an ESD engineer, and over the years, Olivier has worked on many projects, covering a broad range of technologies from High Voltage BCD to the latest nanometer Finfet processes. His professional focus is on continuously adding value to customers through his work, delivering state-of-the-art ESD solutions for the ever-evolving landscape of semiconductor applications.

Olivier has (co-)authored several papers on ESD and contributed as an inventor on many patents. In addition to his technical contributions, Olivier is dedicated to sharing his knowledge and insights. He has conducted several tutorials on on-chip ESD protection design for industry professionals around the world.

Andy Nold is a Quality Engineer and Commodity Engineer at Teradyne near Chicago, IL. He is the Factory ESD subject matter expert and performs the company’s internal ESD audits. He has worked for Teradyne since 2011.

Prior to Teradyne, Andy worked for the FAA, a small aerospace company, and the US Navy. Andy graduated from the University of Wisconsin with a bachelor’s degree in Applied Math, Engineering, and Physics and a master’s degree in Engineering Mechanics. 

Outside of work, Andy likes to spend time with his wife and kids.

David E. Swenson retired in 2003 after 35 years of service from 3M. While at 3M he had responsibility for new packaging material development and application, training of 3M personnel worldwide and providing application assistance to users of static control products globally with particular emphasis on Asia Pacific and Japan. Dave and his wife Geri established a new company, Affinity Static Control Consulting, LLC. in 2003.

Dave has been a member of the ESD Association since 1984 and has served in many capacities including 1997 Symposium General Chair and president of the Association in 1998 and 1999 and again in 2008 and 2009. He was re-elected to the Board of Directors for a 5th term from 2014 to 2016 and is currently appointed to the Board to assist with technical inquiries.

Dave was presented with the highest award of the ESD Association, the “Outstanding Contributions Award” in 2002, the Standards Committee “Joel P. Weidendorf Memorial Award” in 2004, the Association “Edward G. Weggeland” Memorial Award in 2014 and the Symposium Committee’s, David Barber, Sr. Memorial award in 2018.

He is a member of the Standards Committee serving several Working Groups and the ANSI/ESD S20.20 Standard Task Team.   Dave also serves as Treasurer and Information Liaison of the Texas Chapter of the ESD Association; he is a member of the Electrostatic Society of America, IMAPS, the UK Institute of Physics and is a US Expert to IEC TC101, Electrostatics. 

Jay Skolnik is a licensed professional electrical engineer and is the co-founder and lead engineer/consultant of Skolnik Technical Training in Albuquerque, NM. With over thirty years of experience in the electronics industry, Jay has developed a multitude of products utilized in different industries, including military, defense, avionics, aerospace, commercial, industrial, medical, automotive, and sports entertainment.

As an ESDA certified program manager, Jay teaches ESD mitigation and control for the electronics and energetics specialties. He performs ESD audits to ensure factories and laboratories are following safe ESD control guidelines and procedures. He is also certified by iNARTE and is a certified professional instructor of national instruments (NI). He received his electrical engineering degree from the University of Missouri-Rolla.

Wim Vanhouteghem is a Senior ESD Design Engineer and the head of the measurement lab at Sofics. A 2007 graduate of KHBO (now part of the Catholic University of Leuven), Wim joined Sofics immediately after completing his studies. His work primarily focuses on ESD protection in semiconductor technologies, ranging from high-voltage BCD to FinFETs.

Wim has plenty of experience in implementing ESD protection and conducting ESD measurements. He contributed to the SEED concept and has worked on system-level ESD measurements on bare dies. 

Dr. Ir. Dolphin Abessolo-Bidzo received his M.Sc. (2004) and his Ph.D. (2007) in Electrical Engineering from ENSICAEN and from the University of Basse-Normandie, France. He is currently working as Senior Principal RF ESD & Latch-Up Design Engineer for advanced RFCMOS and BiCMOS technologies of RF and Millimeter wave applications at NXP Semiconductors.

Dolphin has published numerous articles and papers in IEEE scientific journals, symposia, and conferences on ESD, RF, and time domain analysis and holds several patents in the field of ESD protection of integrated circuits (ICs).

He is an active member of the ESDA Workgroup-18 on Electronic Design Automation (EDA) for ESD. For more than 15 years, he has regularly served in the management and the technical program committees of the International Electrostatic Discharge Workshops (IEW’s) and the EOS/ESD Symposia. Dolphin was the Management Committee General Chair of the IEW2023 in Germany and is a 2024 member of the Board of Directors.

Dr. Mirko Scholz received his Ph.D. in Electrical Engineering from the Vrije Universiteit in Brussels (VUB) in 2013. From 2005 until 2017, he was working as an ESD researcher at imec in Leuven/Belgium. From March 2017 until June 2019, he was a program manager at the imec academy and in imec’s process technology transfer activities. Since July 2019, he has been with Infineon Technologies in Munich/Germany, where he is a Principal Engineer in ESD Development. His daily work focuses on component- and system-level ESD protection design for several RF and sensor product lines at Infineon.

Since 2007 he has been an active member of different working groups in the ESDA standards committee, currently co-chairing WG 5.6 (Human Metal Model). He was the management chair of the IEW 2018 in Belgium. Since 2019 he has been a member of the steering committee of the EOS/ESD Symposium. In this function, he is the Technical Program Committee (TPC) chair of the EOS/ESD Symposium 2023. For the 2017-2019 term and again for the 2022-2024 term, he has been an elected member of the ESDA Board of Directors. Since 2017, he has been heading the business unit of the Advanced Topics Committee of the ESDA.

He has authored/co-authored more than 100 publications, tutorials, and patents in the field of ESD design and testing. He is co-author of the 2014 Springer book “System-level ESD Protection”. He is a regular reviewer for several IEEE journals and a current member of the IRPS sub-committee on ESD and Latchup.

Andy Nold is a Quality Engineer and Commodity Engineer at Teradyne near Chicago, IL. He is the Factory ESD subject matter expert and performs the company’s internal ESD audits. He has worked for Teradyne since 2011.

Prior to Teradyne, Andy worked for the FAA, a small aerospace company, and the US Navy. Andy graduated from the University of Wisconsin with a bachelor’s degree in Applied Math, Engineering, and Physics and a master’s degree in Engineering Mechanics. 

Outside of work, Andy likes to spend time with his wife and kids.

Chandra Mouli is with Micron Technology Inc., Boise, ID, USA. He is currently Vice President of Device Technology R&D with responsibilities in the areas of device characterization, reliability analysis, compact models, test structure design, process & device modeling for all technologies under development in R&D. He received his undergraduate degree in Physics and MSEE from the Indian Institute of Science (IISc), Bangalore, India and Ph.D. (EE) from the University of Texas at Austin in 1994. He has previously worked at Texas Instruments Inc. He was a visiting scholar (VSRP program) at the Tata Institute of Fundamental Research (TIFR) and has been an intern at the Defense Electronics Application Lab (DEAL) in Dehra Dun. His interests include semiconductor devices and process technology for advanced memory, optoelectronic devices, and exploratory research in the area of new materials and device structures. He has ~500 issued patents and several pending in various areas of semiconductor devices and processes – in advanced memory, novel exploratory devices, image sensors, high-speed interconnects, and related technologies. He has served on the technical committees for various conferences, including IEDM, IRPS, and SISPAD. He has also served on the review committees for NSF and SRC and as an editor for IEEE Electron Device Letters (EDL).

Kathleen Muhonen is currently an ESD engineer at Qorvo in Greensboro, NC.  She is involved in ESD on-chip protection for RF and Millimeter wave applications.  She is heavily involved in system level testing that helps standardize IED testing of RF components and instrumentation for better ESD characterization of clamps and materials. Previously she was responsible for RF characterization and model support for SOI switches and Gallium Arsenide power amplifiers. She has also done extensive work on developing state of the art harmonic and breakdown characterization system for semiconductors and has improved de-embedding techniques of large-scale modeling structures.  Kathleen's previous experience includes assistant professor at Penn State Erie, linearization design for base stations at Hewlett Packard, and power amplifier design at Lockheed Martin and GE Aerospace. 
Kathleen is a member of the ESD association and is on all device testing standards committees, including serving as past TLP and HMM workgroup chairs. She has also served on the Board of Directors and is now serving as the education committee chair. Kathleen received her BSEE degree from Michigan Technological University in 91, a MSEE from Syracuse in 94 and a PH.D.EE from Penn State University in 99. 

Dr. Philippe Galy, born 1965, obtained his Ph.D. from the University of Bordeaux (France) in 1994. He holds also a H.D.R. (academic research supervisor) from LAAS CNRS University of Toulouse in 2005. He has authored or co-authored over 150 publications, 4 books, and 140 patents portfolio. Philippe serves in several technical program committee and he is a reviewer for many symposiums and journals (Ex: Nature/VLSI/TED/TON/SSE/ ESREF/ESSDERC/ICICDT/EUROSOI/CAS).
He joined STMicroelectronics in 2005, working on ESD/LU and new solutions from device to SOC level in advanced CMOS and mature technologies (Bulk / FD-SOI / planar & 3D). He develops tooling concepts for robust IP integration and supervises its developments till massive production. Moreover, its main R&D topics are on SCR, T2, TFET, BIMOS transistor, Beta-structure and other innovative devices for emerging neuromorphic, Qubit applications. Philippe is in charge for STMicroelectronics on Cryogenic Quantum R&D with many international partners.  Based on these topics he supervises 16 PhD. He was already involved in National & European projects ( Ex.: Nano 2017/ROBIN/REMINDER/Neuram3/ QLSI/ARCTIC). Also, he joins the QuEng CDP group from Grenoble France. Its Position today is Fellow technical Director and adjunct professor at UdS.

Chloé Troussier received her Ph.D. degree in 2022 from University Grenoble Alpes of Grenoble, France. During her Ph.D. thesis (20018-2022), she worked on on the study of Charged Device Model phenomenon in STMicroelectronics. Since 2021, she joined STMicroelectronics Crolles as a Research Engineer working on ESD protections and strategies.

Dr. Philippe Galy, born 1965, obtained his Ph.D. from the University of Bordeaux (France) in 1994. He holds also a H.D.R. (academic research supervisor) from LAAS CNRS University of Toulouse in 2005. He has authored or co-authored over 150 publications, 4 books, and 140 patents portfolio. Philippe serves in several technical program committee and he is a reviewer for many symposiums and journals (Ex: Nature/VLSI/TED/TON/SSE/ ESREF/ESSDERC/ICICDT/EUROSOI/CAS).
He joined STMicroelectronics in 2005, working on ESD/LU and new solutions from device to SOC level in advanced CMOS and mature technologies (Bulk / FD-SOI / planar & 3D). He develops tooling concepts for robust IP integration and supervises its developments till massive production. Moreover, its main R&D topics are on SCR, T2, TFET, BIMOS transistor, Beta-structure and other innovative devices for emerging neuromorphic, Qubit applications. Philippe is in charge for STMicroelectronics on Cryogenic Quantum R&D with many international partners.  Based on these topics he supervises 16 PhD. He was already involved in National & European projects ( Ex.: Nano 2017/ROBIN/REMINDER/Neuram3/ QLSI/ARCTIC). Also, he joins the QuEng CDP group from Grenoble France. Its Position today is Fellow technical Director and adjunct professor at UdS.

Chloé Troussier received her Ph.D. degree in 2022 from University Grenoble Alpes of Grenoble, France. During her Ph.D. thesis (20018-2022), she worked on on the study of Charged Device Model phenomenon in STMicroelectronics. Since 2021, she joined STMicroelectronics Crolles as a Research Engineer working on ESD protections and strategies.

Carl Newberg is the manager of the Applications Engineering Team at Simco-Ion Technology, an ITW Company. Simco-Ion develops ionization solutions for high-technology semiconductor, electronics, and life science manufacturing. He has a B.S. degree in Metallurgical Engineering, an M.S. Degree in Materials Science, and a professional engineer’s license (Met. Eng.). He was among the first to test and receive certification from the ESDA as a Certified ESD Program Manager. He held positions as the ESD Program Manager for Western Digital Corporation and has been actively involved in the corporate ESD and contamination control programs at Seagate Technology and IBM Corporation. Carl has been a member of the ESD Association since 1995, actively participating as a board member, on many other major committees, and as a tutorial instructor. He currently is the ESD Association working group chairman of WG3 (Ionization) and WG28 (Electrostatic Attraction). He is co-author of "Contamination and ESD Control in High Technology Manufacturing", a book published by John Wiley & Sons.

Tom Ricciardelli received a SB and SM in Chemical Engineering from MIT in 1985 and an MBA from the Sloan School of Management in 1991. In 1993, he founded SelecTech with the mission of creating valuable products from recycled materials.   He has over 30 years of experience with developing unique polymer blends to meet demanding technical requirements and holds several patents for products and processes using recycled materials.  He was the first to conceive of and develop an adhesive-free, interlocking static-control flooring system which paved the way for the StaticStop line of industry-leading ESD flooring products.

With this product, he was flung headlong into the ESD industry and joined the ESD Association in 2013 to become more involved in the industry and better understand the full needs of his customers.  He is now the chair of WG 7  and WG29 and a member of WG19, WG28, WG4, and WG97.  “While I have a strong engineering background with degrees in chemical engineering, my knowledge of electronics and ESD was certainly limited.  Being involved in the ESD association, through the committees, the available training information, and generous support from other members, I’ve learned a vast amount about ESD and its control.  I particularly enjoy networking with the other members, working with them on the committees, and having a little fun during the free time.”

Yujie Zhou received the B.S. degree in electrical engineering from University of Illinois Urbana-Champaign (UIUC), Urbana, IL,USA, in 2019. He is currently pursuing the Ph.D. degree in electrical engineering with UIUC. His research interests include ESD, device physics, compact modeling, and TCAD.

Ellen Jirutková joined the Analysis & Test group at Fraunhofer EMFT in 2018 and has been supporting the team in researching topics related to electrostatic discharges. She received her Bachelor (2018) and Master degree (2021) at the Technical University of Munich (TUM), Germany. Since then, she has been working as research associate at Fraunhofer EMFT, specializing on ESD test methods, ESD robustness and protection and simulations. In 2022, she started to work on her PhD with the focus on ESD risks in Multi-Chip Modules (MCM) and Systems in Package (SiP). Ellen is an active member of the ESD Association and joined the steering committee of the International ESD Workshop 2023 in Tutzing, Germany.

Kuo-Hsuan Meng received his B.S. degree from the Department of Electronics Engineering, and M.S. degree from the Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, in 2006 and 2007, respectively. He received his Ph.D. degree from the Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, in 2015. He worked at Freescale / NXP Semiconductors, Austin, TX, from 2015 to 2021. He joined Silicon Laboratories, Austin, TX, since 2021. His research interests include ESD protection network design, I/O library architecture, and CAD/EDA for SoC integration and ESD/latch-up design verification.

Toni Viheriäkoski established electrostatics laboratory services for Nokia in 2001. He received iNARTE ESD engineer certification in 2004. Since 2008, he has been working on electrostatic and ESD risk analysis in healthcare, medical, electronics, automotive and process industries at Cascade Metrology Oy. Toni has written more than 30 publications. He has been the chair of the Finnish STAHA Association since 2006 and the chair of the Finnish Standardization Committee SK101 since 2016. He received specialist qualification in business management in 2018 and 1906 award of IEC in 2019. He is a member of several IEC and ESDA working groups.

Kuo-Hsuan Meng received his B.S. degree from the Department of Electronics Engineering, and M.S. degree from the Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan, in 2006 and 2007, respectively. He received his Ph.D. degree from the Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, in 2015. He worked at Freescale / NXP Semiconductors, Austin, TX, from 2015 to 2021. He joined Silicon Laboratories, Austin, TX, since 2021. His research interests include ESD protection network design, I/O library architecture, and CAD/EDA for SoC integration and ESD/latch-up design verification.

Yujie Zhou received the B.S. degree in electrical engineering from University of Illinois Urbana-Champaign (UIUC), Urbana, IL,USA, in 2019. He is currently pursuing the Ph.D. degree in electrical engineering with UIUC. His research interests include ESD, device physics, compact modeling, and TCAD.

Ellen Jirutková joined the Analysis & Test group at Fraunhofer EMFT in 2018 and has been supporting the team in researching topics related to electrostatic discharges. She received her Bachelor (2018) and Master degree (2021) at the Technical University of Munich (TUM), Germany. Since then, she has been working as research associate at Fraunhofer EMFT, specializing on ESD test methods, ESD robustness and protection and simulations. In 2022, she started to work on her PhD with the focus on ESD risks in Multi-Chip Modules (MCM) and Systems in Package (SiP). Ellen is an active member of the ESD Association and joined the steering committee of the International ESD Workshop 2023 in Tutzing, Germany.

Toni Viheriäkoski established electrostatics laboratory services for Nokia in 2001. He received iNARTE ESD engineer certification in 2004. Since 2008, he has been working on electrostatic and ESD risk analysis in healthcare, medical, electronics, automotive and process industries at Cascade Metrology Oy. Toni has written more than 30 publications. He has been the chair of the Finnish STAHA Association since 2006 and the chair of the Finnish Standardization Committee SK101 since 2016. He received specialist qualification in business management in 2018 and 1906 award of IEC in 2019. He is a member of several IEC and ESDA working groups.

Carl Newberg is the manager of the Applications Engineering Team at Simco-Ion Technology, an ITW Company. Simco-Ion develops ionization solutions for high-technology semiconductor, electronics, and life science manufacturing. He has a B.S. degree in Metallurgical Engineering, an M.S. Degree in Materials Science, and a professional engineer’s license (Met. Eng.). He was among the first to test and receive certification from the ESDA as a Certified ESD Program Manager. He held positions as the ESD Program Manager for Western Digital Corporation and has been actively involved in the corporate ESD and contamination control programs at Seagate Technology and IBM Corporation. Carl has been a member of the ESD Association since 1995, actively participating as a board member, on many other major committees, and as a tutorial instructor. He currently is the ESD Association working group chairman of WG3 (Ionization) and WG28 (Electrostatic Attraction). He is co-author of "Contamination and ESD Control in High Technology Manufacturing", a book published by John Wiley & Sons.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Carl Newberg is the manager of the Applications Engineering Team at Simco-Ion Technology, an ITW Company. Simco-Ion develops ionization solutions for high-technology semiconductor, electronics, and life science manufacturing. He has a B.S. degree in Metallurgical Engineering, an M.S. Degree in Materials Science, and a professional engineer’s license (Met. Eng.). He was among the first to test and receive certification from the ESDA as a Certified ESD Program Manager. He held positions as the ESD Program Manager for Western Digital Corporation and has been actively involved in the corporate ESD and contamination control programs at Seagate Technology and IBM Corporation. Carl has been a member of the ESD Association since 1995, actively participating as a board member, on many other major committees, and as a tutorial instructor. He currently is the ESD Association working group chairman of WG3 (Ionization) and WG28 (Electrostatic Attraction). He is co-author of "Contamination and ESD Control in High Technology Manufacturing", a book published by John Wiley & Sons.

Dr. Chuan Xu received the B.S. and the M.S. from Peking University. He received the Ph.D. from University of California at Santa Barbara in 2012. During his Ph.D. program, he interned with IBM T. J. Watson Research Center and Mentor Graphics Corporation. In 2012, he joined the Device Modeling Team of Legacy Maxim Integrated (acquired by Analog Devices since 2021). His current research interests include modeling of active devices, parasitic devices, interconnects and packages in VLSI circuits. He has authored or co-authored over 40 journal and conference papers.

Subhadeep Ghosh received his Bachelor's Degree in Electronics from Jadavpur University, Kolkata, India, and Masters Degree in Electronics from Indian Institute of Technology, Kharagpur, India. He joined Texas Instruments in Bangalore, India in 2005 and has since worked on Reliability EDA development for EMIR analysis, Transistor reliability and ESD. Currently he leads the EDA Development for Reliability, ESD and IR-drop analyses for all TI internal process nodes. He is a Member, Group Technical Staff (MGTS). His areas of expertise are design reliability, ESD EDA, digital design IR-drop, with methods enabling reliability as a specification through the design flow.

Subhadeep Ghosh received his Bachelor's Degree in Electronics from Jadavpur University, Kolkata, India, and Masters Degree in Electronics from Indian Institute of Technology, Kharagpur, India. He joined Texas Instruments in Bangalore, India in 2005 and has since worked on Reliability EDA development for EMIR analysis, Transistor reliability and ESD. Currently he leads the EDA Development for Reliability, ESD and IR-drop analyses for all TI internal process nodes. He is a Member, Group Technical Staff (MGTS). His areas of expertise are design reliability, ESD EDA, digital design IR-drop, with methods enabling reliability as a specification through the design flow.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Dr. Chuan Xu received the B.S. and the M.S. from Peking University. He received the Ph.D. from University of California at Santa Barbara in 2012. During his Ph.D. program, he interned with IBM T. J. Watson Research Center and Mentor Graphics Corporation. In 2012, he joined the Device Modeling Team of Legacy Maxim Integrated (acquired by Analog Devices since 2021). His current research interests include modeling of active devices, parasitic devices, interconnects and packages in VLSI circuits. He has authored or co-authored over 40 journal and conference papers.

Daniel Cooley serves as Chief Technology Officer and Senior Vice President, Technology and Product Development, where he is responsible for the company’s overall research and development strategy and execution. Cooley is a respected IoT industry veteran and has been instrumental in building the unmatched breadth and depth of the company’s wireless connectivity portfolio. Previously, Daniel served as Senior Vice President and Chief Strategy Officer, where he led Silicon Labs’ overall strategy, corporate development, M&A, emerging markets, and security. Prior to that, Daniel led Silicon Labs’ IoT business as Senior Vice President and General Manager. Since 2005, Cooley has served in a variety of engineering and business leadership positions at Silicon Labs in the US, Asia and Europe. He has an M.S. in Electrical Engineering from Stanford University and a B.S. in Electrical Engineering from The University of Texas at Austin and holds five patents in radio and low-power technology. Daniel currently serves on the board of directors for the Cockrell School of Engineering Advisory Board and the Austin Symphony Orchestra.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Steffen Holland received his diploma and PhD in Physics from the University of Hamburg in 2004. He joined Philips Semiconductors/NXP/Nexperia in the process development group for discrete bipolar devices in Hamburg, Germany in 2005. The main focus of his work quickly became TCAD process and device simulations for discrete ESD protection devices. He works now on discrete ESD protection devices. His current interests are system level ESD simulations. He currently serves in the Board of Directors at the ESD Association and is chair of the ESDA working group 26.

Steffen Holland received his diploma and PhD in Physics from the University of Hamburg in 2004. He joined Philips Semiconductors/NXP/Nexperia in the process development group for discrete bipolar devices in Hamburg, Germany in 2005. The main focus of his work quickly became TCAD process and device simulations for discrete ESD protection devices. He works now on discrete ESD protection devices. His current interests are system level ESD simulations. He currently serves in the Board of Directors at the ESD Association and is chair of the ESDA working group 26.

Seyed Mostafa Mousavi (Senior Member, IEEE) received the B.Sc. degree from the Iran University of Sci. and Tech., Tehran, Iran, in 2007, and the M.Sc. and Ph.D. degrees from the K.N. Toosi University of Tech., Tehran, Iran, in 2010 and 2016, respectively, all in electrical engineering. In 2022, he joined Graz University of Technology, Graz, Austria before moving to the EMC Lab, Missouri University S&T, Rolla, MO, USA, where he is currently a Postdoctoral Fellow, specializing in EMC, ESD, and signal integrity.

Wolfgang Stadler received his diploma degree in physics in 1991 and in 1995 the PhD degree from the Physics Department of the Technical University Munich. 1995 he joined the semiconductor division of Siemens, which became Infineon Technologies in 1999. His focus was on development of ESD-protection concepts in CMOS technologies and on innovative ESD topics. In this role he was coordinator of several European and German ESD funding projects. Since 2003 he was also responsible for the measurement characterization of I/O cells and PHYs. 2011 he joined Intel Mobile Communications which is now Intel Germany Services GmbH. Within the Corporate Quality Network, he is currently responsible for the ESD Control Program of Intel and for ESD risk assessment. Furthermore, he supports ESD/latch-up testing and qualification of products. Wolfgang holds several patents in ESD-related topics. He is author or co-author of more than 120 technical papers and has co-authored a book on ESD simulation. He received several Best Paper Awards and gives regularly courses on ESD device testing, ESD qualification, and ESD control measures (for example, TR53 ESD Technician Certification). He is an active member of the EOS/ESD Association working groups related to device and system testing, ESD control, and ESD process assessment. He is also a member of STDCOM and TAS of the EOS/ESD Association. Currently he is the committee chair of the EOS/ESD Association Working Group 5.4 “Transient Latch-up” (since 2011) and the Working Group 12 “Seating”; since 2013 he has been co-chairing the ESDA Working Group 17 “Process Assessment”. Wolfgang has been elected to serve on the Board of Directors of the EOS/ESD Association for 2014–2019; 2015–2022 he was Education Business Unit Manager of the ESDA. Since 2015 he is acting as the president of the German ESD FORUM e.V. In 2019, he received the Outstanding Contribution Award of the EOS/ESD Association.

Masanori Sawada was born in Wakayama, Japan, 1973. He received his M.S. from Wakayama University in March 1998. He joined Hanwa Electronic Ind. in April 1998. Currently, he is the president of HANWA ELECTRONIC IND.

Youngbong Han received his B.S. degree in 2015 and his M.S. and Ph.D degrees in 2020 from the College of Information and Communication Engineering, Sungkyunkwan University, Suwon, South Korea. Since 2020, he has been working on quality assurance tasks related to Electromagnetic Compatibility, Electrostatic Discharge, and Signal Integrity at Samsung Electronics' Device Solutions Quality Synergy P/J.

Youngbong Han received his B.S. degree in 2015 and his M.S. and Ph.D degrees in 2020 from the College of Information and Communication Engineering, Sungkyunkwan University, Suwon, South Korea. Since 2020, he has been working on quality assurance tasks related to Electromagnetic Compatibility, Electrostatic Discharge, and Signal Integrity at Samsung Electronics' Device Solutions Quality Synergy P/J.

Masanori Sawada was born in Wakayama, Japan, 1973. He received his M.S. from Wakayama University in March 1998. He joined Hanwa Electronic Ind. in April 1998. Currently, he is the president of HANWA ELECTRONIC IND.

Shih-Hung Chen has been with imec since 2010, and as ESD team lead and principal member of technical staff (PMTS) since 2019. He authored or co-authored more than 100 conference and journal publications. His current research interests include ESD protections in advanced sub-5nm technology nodes, in 3D/2.5D IC applications, and in Design Technology Co-Optimization (DTCO), System Technology Co-Optimization (STCO) with the integrations of III-V compounds.

Timothy J. Maloney graduated in physics and EE from MIT (SB 1971) and Cornell (MS 1973, PhD 1976). Following postdoctoral work at Cornell and semiconductor research at Varian Associates, Palo Alto, CA, he joined Intel Corp., Santa Clara, CA, in 1984, and has been concerned with IC ESD protection and testing, signal integrity, system ESD, and other topics. Dr. Maloney became a Senior Principal Engineer at Intel and retired in 2016. He has 40 patents, is co-author of a book, "Basic ESD and I/O Design" (Wiley, 1998), and is a Fellow of the IEEE. He has many publications at the EOS/ESD Symposium, IRPS, and other IEEE-connected entities.

Dr. Vladislav Vashchenko is currently Sr. Director Power ESD Group at Analog Devices Corp since 2011. He is responsible for aspects of power analog ESD/Latchup IC co-design business process and technology development. Previously he managed ESD technology development at National Semiconductor (2000-2011). He received MS Engineer-Physicist (1987), Ph.D. in Physics of Semiconductors from MIPT (1990), "Doctor of Science in Microelectronics" habilitation degree (1997). He is author of 150 U.S. patents, over 120 papers, co-author of the three books in ESD field.

Lena Zeitlhöfler received her Master's degree in Electrical Engineering in 2017 from the Technical University of Munich (TUM). During her time as a Ph.D. student at the TUM, she worked in cooperation with Infineon Technologies AG in the fields of ESD and, particularly, on the physics of CDM and CDM simulation. She joined the ESD Team of Infineon in Munich, Germany, full-time in September 2021.

Michael Amato graduated from Rensselaer Polytechnic Institute with a BSEE in ‘82 and MSEE in '84, with emphasis in semiconductor device and IC technology. At Philips Research he led teams developing new monolithic Power IC technologies and TFT arrays for LCD HDTV. Working at Allegro Microsystems & CPClare (IXYS), he also directed CAD/PDK development and device modeling. In 2004 he joined Linear Technology Corp (now Analog Devices Inc) directing all ESD Co-design and new ESD device development for in-house and foundry processes, developing unique ESD solutions for High Voltage, Power, Analog, Digital, and Mixed Signal ICs.

Marko Simicic received the M.Sc. degree in electrical engineering and information technology from the University of Zagreb, Croatia, in 2012. He obtained a PhD degree from the department of electrical engineering ESAT, KU Leuven, Belgium in 2018. Since 2017 he is an ESD researcher in imec, Belgium. He is a certified ESD control program manager since 2022. He has authored or co-authored more than 40 papers in international journals and conference proceedings. His current research area is rather wide and includes ESD device and circuit design in advanced semiconductor and 3D/2.5D stacking technologies, novel ESD testing and ESD control process assessment.

Michael Amato graduated from Rensselaer Polytechnic Institute with a BSEE in ‘82 and MSEE in '84, with emphasis in semiconductor device and IC technology. At Philips Research he led teams developing new monolithic Power IC technologies and TFT arrays for LCD HDTV. Working at Allegro Microsystems & CPClare (IXYS), he also directed CAD/PDK development and device modeling. In 2004 he joined Linear Technology Corp (now Analog Devices Inc) directing all ESD Co-design and new ESD device development for in-house and foundry processes, developing unique ESD solutions for High Voltage, Power, Analog, Digital, and Mixed Signal ICs.

Shih-Hung Chen has been with imec since 2010, and as ESD team lead and principal member of technical staff (PMTS) since 2019. He authored or co-authored more than 100 conference and journal publications. His current research interests include ESD protections in advanced sub-5nm technology nodes, in 3D/2.5D IC applications, and in Design Technology Co-Optimization (DTCO), System Technology Co-Optimization (STCO) with the integrations of III-V compounds.

Dr. Vladislav Vashchenko is currently Sr. Director Power ESD Group at Analog Devices Corp since 2011. He is responsible for aspects of power analog ESD/Latchup IC co-design business process and technology development. Previously he managed ESD technology development at National Semiconductor (2000-2011). He received MS Engineer-Physicist (1987), Ph.D. in Physics of Semiconductors from MIPT (1990), "Doctor of Science in Microelectronics" habilitation degree (1997). He is author of 150 U.S. patents, over 120 papers, co-author of the three books in ESD field.

Dr. Larry Levit provides a variety of ESD consulting services as LBL Scientific. He was Global ESD program Manager for Finisar Corporation and Chief Scientist for MKS, Ion Systems, He has over 20 years of experience in the field of ESD control. He is a NARTE Certified ESD Engineer. Levit has audited cleanrooms on three continents and is recognized as a problem solver. He has successfully devised solutions to manufacturing problems to reduce ESD yield loss, contamination issues and reticle damage. Before joining MKS, Ion Systems, Levit held technical rolls at LeCroy Corporation and Jandel Scientific Software. At LeCroy, he contributed to the instrumentation designs for 6 experiments which produced Nobel prizes in physics. Levit taught physics at CWRU, LSU, and at Napa Valley Community College. He is a senior member of the ESD Association, a senior member of the IEST and chairs the WG CC022 Working Group for IEST. Levit graduated from Case Institute of Technology, Cleveland, Ohio with a BS degree in physics with honors. He then went on to earn a Ph.D. in Experimental High Energy Physics from Case Western Reserve University.

Andy Nold is a Quality Engineer and Commodity Engineer at Teradyne near Chicago, IL. He is the Factory ESD subject matter expert and performs the company’s internal ESD audits. He has worked for Teradyne since 2011.

Prior to Teradyne, Andy worked for the FAA, a small aerospace company, and the US Navy. Andy graduated from the University of Wisconsin with a bachelor’s degree in Applied Math, Engineering, and Physics and a master’s degree in Engineering Mechanics. 

Outside of work, Andy likes to spend time with his wife and kids.

Frank Altmann received his Diploma in Physics from the Technical University, Dresden. He joined the Fraunhofer IWM (now IMWS) in 1997 and has since been concerned with material diagnostics and failure analysis of semiconductor components. Since 2006, he has been head of the research group Diagnostics of Semiconductor Technologies, with responsibility for national and international research projects with industry and public organizations focusing on 3D packaging and Si and GaN chip technologies. Since 2019, he has been acting head of the department of Electronic Materials and Components. Frank Altmann has authored and co-authored more than 130 publications, is active within several national and international failure analysis conferences and education committees, and was the general chair of ISTFA 2023.

Wei-Min Wu received the dual-Ph.D. degrees in electrical engineering from the KU Leuven, Belgium, and in electronic engineering from National Yang Ming Chiao Tung University (NYCU), Taiwan in 2022. He is now with IMEC, Leuven, Belgium as an RF ESD researcher. His current research interests include ESD protections in Design Technology Co-Optimization (DTCO) with the Si/III-V RF devices and circuits and in high-speed I/O technology.

After receiving his Ph.D. from the Eindhoven University of Technology with a thesis on compact device modelling, Theo Smedes worked at the Delft University of Technology on layout-to-circuit extraction. In 1995 he joined NXP Semiconductors (Philips Semiconductors at that time), working on tools for statistical design. Currently, he is NXP Fellow for ESD and Latch-up. Theo is member of all ESDA device testing working groups and chairs the TLP working group. He published several papers on ESD and received the 2007 Best Paper Award and the 2009, 2018 and 2022 Outstanding Paper Award of the EOS/ESD Symposium. Theo was general chair of the EOS/ESD Symposium in 2013. He has been recognized with ESDA's David F. Barber Sr. Memorial Award (2017) and Outstanding Contribution Award (2022).

James Davis received a B.S. degree in electrical engineering from Brigham Young University (Provo, Utah USA) in 2002. He has been involved with on-chip ESD protection at Micron Technology, Inc. (Boise, Idaho USA) for the past twenty years. He is currently part of the R&D group focusing on on-chip ESD protection and design for NAND flash products. Mr. Davis is currently a Senior Member Technical Staff ESD/Latchup engineer.

Sheela Verwoerd received her M.Sc in Applied Physics in 2000 at the Indian Institute of Technology, Madras, India. She then moved to the Netherlands, where she did her PhD on "Full Chip Modelling of ICs under CDM stress" in the University of Twente in Enschede. She worked as ESD Assurance Engineer at Philips Semiconductors for a couple of years. After a brief gap of 10 years, she joined NXP Semiconductors as Principal ESD/LU test Engineer. She had been focused on ESD/LU qualification of ICs since then.

Priya Walimbe has a master's degree in EE wand 25 years of experience in High Speed IO and Analog design. Currently, she is a Principal Engineer at Intel, providing technical leadership for innovations in state-of-the-art IO design and methodologies. She one of the leaders in architecture and design of several generations of DDR/LPDDR PHYs. She has heavily contributed to design technology co-optimization on Intel internal and external foundry. Priya has been an active member of ESD community at Intel, leading ESD design and verification improvements and innovations. She holds 6 patents, authored/co-authored many publications. She's art loving and enjoys classical music.

Emanuele Groppo received his B.Sc. (2020) and M.Sc. (2022) in Electronic Engineering from Politecnico di Torino, Italy. He is currently pursuing a Ph.D. at the Technical University of Munich (TUM), Chair of Circuit Design. In 2023, he joined the ESD team at Intel in Munich, Germany. The focus of his research is on novel ESD devices and solutions for advanced semiconductor technologies.

James Davis received a B.S. degree in electrical engineering from Brigham Young University (Provo, Utah USA) in 2002. He has been involved with on-chip ESD protection at Micron Technology, Inc. (Boise, Idaho USA) for the past twenty years. He is currently part of the R&D group focusing on on-chip ESD protection and design for NAND flash products. Mr. Davis is currently a Senior Member Technical Staff ESD/Latchup engineer.

Priya Walimbe has a master's degree in EE wand 25 years of experience in High Speed IO and Analog design. Currently, she is a Principal Engineer at Intel, providing technical leadership for innovations in state-of-the-art IO design and methodologies. She one of the leaders in architecture and design of several generations of DDR/LPDDR PHYs. She has heavily contributed to design technology co-optimization on Intel internal and external foundry. Priya has been an active member of ESD community at Intel, leading ESD design and verification improvements and innovations. She holds 6 patents, authored/co-authored many publications. She's art loving and enjoys classical music.

Wei-Min Wu received the dual-Ph.D. degrees in electrical engineering from the KU Leuven, Belgium, and in electronic engineering from National Yang Ming Chiao Tung University (NYCU), Taiwan in 2022. He is now with IMEC, Leuven, Belgium as an RF ESD researcher. His current research interests include ESD protections in Design Technology Co-Optimization (DTCO) with the Si/III-V RF devices and circuits and in high-speed I/O technology.